Product Title

PCIe 6.0 MCIO 8X to 16X CEM Riser Cable with Active Power Delivery & EMI Shielded Braided Sleeving | Factory Direct Supply

Product Overview

In modern data center architectures pursuing extreme computational power and high-density stacking, physical space limitations and high-frequency signal attenuation present dual challenges for engineers. To address these critical constraints, we introduce the PCIe 6.0 MCIO 8X to 16X CEM Cable, specifically engineered for flexible expansion card deployment in space-constrained environments.

This product eliminates traditional rigid connection limitations by routing dual MCIO high-density interfaces to full-length PCIe 16X CEM slots. Combined with high-strength EMI-shielded braided sleeving and independent power delivery design, it ensures 64 GT/s PAM4 signal integrity while providing stable support for high-power computational accelerators.

Key Advantages

•Ultimate Signal Integrity: Premium 29AWG/30AWG/32AWG high-speed shielded cables precisely matched to 85Ω (or 100Ω) impedance standards. Rigorous high-frequency testing ensures effective suppression of Insertion Loss and Crosstalk, guaranteeing full PCIe 6.0 bandwidth transmission without signal degradation.

•Enterprise-Grade EMI Protection: Fully enclosed high-density braided shielding significantly enhances cable durability against pulling and abrasion in complex chassis environments, while establishing robust Electromagnetic Interference (EMI) shielding to protect against high-frequency component interference.

•Independent Enhanced Power Matrix: Designed for high-power GPU and accelerator requirements, the CEM slot end integrates a dedicated PH3.0 4-Pin auxiliary power interface. Direct power supply connection delivers stable and clean base slot power, completely eliminating motherboard power bottleneck risks during high-load operations.

•Flexible Remote Deployment Solutions: Enables full-size accelerator and network card flexible routing and vertical installation in 1U/2U racks or highly compact custom AI computing systems, optimizing overall system airflow and thermal management.

Technical Specifications

Core Application Scenarios

•AI Inference & Deep Learning Workstations: Perfect for single-system dual GPU (e.g., high-end RTX graphics cards) high-density parallel deployment, solving motherboard slot spacing limitations.

•High-Density Enterprise Servers: Ideal for SmartNIC or high-bandwidth RAID controller card remote installation in 1U/2U/4U rack-mount servers.

•All-Flash Data Center Nodes: Provides reliable, ultra-low latency physical interconnect channels for high-speed NVMe storage arrays.

•Custom Computing Platforms: Supports various non-standard chassis architectures for expansion card routing requirements, enabling optimized space configurations.

Our Manufacturing Capabilities

As a source factory specializing in Server High-Speed Interconnects, we provide end-to-end quality control from terminal crimping to high-frequency testing. This CEM Cable is now available for batch sampling.

Customization Services: We offer precise customization of cable lengths (Length A/B/C) for different chassis internal structures, cable bend angle customization, and OEM/ODM bulk manufacturing. With precise impedance matching and low signal loss, our cables directly adapt to servers, computing clusters, and other high-end hardware equipment, supporting bulk procurement and personalized customization as essential components for data centers and hardware system integrators.

Customizable to Meet Specific Application Requirements